Institut des
NanoSciences de Paris
insp
insp
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Lithographiy zone

The equipment of the INSP authorizes a wide range of available resolutions.

© INSP - L. Becerra {JPEG}
  • Spin coater (Delta 80 Süss Microtec)
    This tool allows the controlled coating of samples with photosensitive resist or with PMMA.
© INSP - L. Becerra {JPEG}
  • Photolithography with direct UV laser writing (DWL 66FS Heidelberg)
    Using a UV laser (405 nm) and an interferometric table, this device allows to realize patterns on the surface of samples previously coated with resist by photolithography. Two writing heads can be used : a first one is used to achieve a resolution of 5 microns and a second one allows for resolutions down to the micron. Possibility to self-align several successive layers on the front and/or the back face of samples. This machine also allows to manufacture photolithography masks.
© INSP - L. Becerra {JPEG}
  • Masks aligner (MJB3 Karl Süss)
    With a resolution of a few microns, this tool is useful to realize quickly UV insolations. Unlike the DWL, the operation of this device requires the use of a suitable photolithography mask (3 inches mask).
© INSP - L. Becerra {JPEG}
  • Electronic lithography (Raith Elphy Quantum)
    This device allows to control the electronic beam of the SEM to come locally expose a layer of PMMA or other electro-sensitive polymers, in order to structure accurately the surface of samples. The theoretical ultimate resolution is 20 nm.